Taiwan's annual PCB repair rate reached 13.5%

The 2011 Suzhou Circuit Board Seminar organized by the Taiwan PCB Association was held last week and a senior analyst at the Institute of Industrial Technology (IEK) Jiang Baifeng said at the meeting that due to the impact of the Great East Japan Earthquake in Japan this year, the market had a turnaround effect. The annual growth rate of PCB production in Taiwan will reach 13.5%, much higher than the 7% forecast at the end of last year. It is estimated that in the next two years (2012, 2013), the Taiwan PCB output value will grow by 8.6 and 11.8% respectively. .

2011 Suzhou Circuit Board Seminar This year, the main axis is "Foresight China, based on the new generation of the PCB industry." Senior researcher Jiang Baifeng from the Industrial Technology Research Institute conducted an analysis on "From the perspective of emerging application trends in the future development of the PCB market." He looks at mobile phones and tablet computers. The market trend of image Sensor will be able to drive the global PCB growth. At the same time, this year due to the impact of the Great East Japan Earthquake, the market has a single transfer phenomenon, estimated that this year Taiwan's PCB output value will reach 6.15 billion US dollars, an annual growth rate of 13.5%, better than the original estimate of 7%.

According to Gartner, according to Gartner, by 2015, the global smart phone will have an estimated value of 468 million sticks this year and grow to 1.18 billion sticks, accounting for 48% of the 2.243 billion branch of the global mobile phone market, which is almost half the proportion. . As for the tablet computer, the iPad opened the door to tablet computers and led many manufacturers to invest in tablet computers. According to iSuppli estimates, the global market share of the Apple iPad will be reduced from 87% last year to 70% this year. In years, it will decline to 37.3%.

Jiang Baifeng pointed out that including smart phones and tablet computers are in urgent need of high-end HDI aids, and the use of miniaturized PCB boards can make the location of the battery larger. Now it becomes a multi-hard board module, and then the soft board is used as a signal. Links, and micro-projection phone is also connected to each module by FPC (soft board), so in addition to the PCB will go to the higher order AnyLayerHDI, the future use of soft board is also more and more.

Taking the iPhone4 as an example, in order to achieve the purpose of thinning, the battery and the PCB are reduced, and the arrangement is left and right. When the width does not change, the problem that the thickness of the iPhone3GS is increased due to the stacking method is avoided. The iPad2 also uses a miniaturized PCB board. The battery is placed in the middle area, and each hard board module is arranged on both sides. The soft board is used as the signal connection.

In addition, the image sensor market has grown rapidly in recent years. In particular, CMOS ImageSensor (CIS) is advancing in semiconductor technology and its image quality is close to the CCD. Because CMOS has the advantage of low cost, it is eroding the application market of traditional CCDs. Currently, it includes mobile phones and notebooks. Computers and tablets are equipped with CMOS camera lenses. Gartner predicts that the CIS market value will grow year by year from 2011 to 2014, and by 2014, the CIS market value will reach US$6.98 billion.

Overall, Jiang Baifeng estimated that with the continuous expansion of emerging applications, the global PCB output value will grow steadily by 7.77% this year to reach US$42.98 billion, of which Taiwan will benefit from this year's growth rate of 9.5% last year. The turnaround effect of the Tohoku Earthquake in Japan will reach a growth rate of 13.5% this year, while the growth rates in 2012 and 2013 will be 8.6% and 11.8%, respectively.