In recent years, LED heat-dissipating substrates have become one of the topics of concern to manufacturers. LEDinside recently interviewed ICP in Taiwan, and Dr. Zhuang Hongyi, general manager, told us about the latest development of LED heat-dissipating substrates and the recent increase in LED industry capacity. After the heat sink substrate demand situation.
The main technology of ICP at this stage
ç‘· æŸ æŸ ç”µå (ICP) is a company started from protective components. The main processes currently offered include thin film heat sinks and yellow light lithography. In the field of LED customers, it is mainly provided to LED lighting manufacturers. Dr. Zhuang pointed out that Taiwanese manufacturers often follow the footsteps of foreign manufacturers and produce LED substrates for high-power LEDs, which are widely used in lighting applications. Integrating the LED concept with the concept of protection components is one of ICP's current strengths.
At present, the direction of ICP lighting application products is to integrate LED components and LED heat-dissipating substrates. In addition, we are actively developing next-generation products to integrate protection components, LED components, and heat-dissipating substrates. As a result, lighting manufacturers are more likely to purchase components for LED lighting, saving time on their own development and further reducing the cost of LED lighting.
Dr. Zhuang said that domestic and foreign LED manufacturers are trying to save the space of LED components, and it is expected that the protection components will be directly typed into the ceramic substrate. The product that ICP is doing now is to put the protection components in the circuit design without any additional Save cost by entering protective components.
At present, LED package customers and ICP cooperation can save the work of wiring, save the area of ​​protection components, and further save space. Dr. Zhuang pointed out that if you don't do this, the extra space will be rectangular, easy to have polarized problems, and you can't arrange them symmetrically. This technology can reduce the size and reduce the space by 20 to 30%.
Advantages of the ICP team
When ICP was first established, it hoped to go out of a different path. Not only that, but in addition to integrated substrate products, ICP can also supply existing substrates to general manufacturers, or to make special substrates for packaging manufacturers.
Dr. Zhuang stressed that the company's engineers will go out to assist in the design, establish the uniqueness of the company, and control the cost in line with the needs of customers. He believes that the team's engineering background is strong, and the technology platform used can do a lot of things, so that everyone can understand the market demand, in order to make products that meet market demand. Since the market for lighting has been changing, engineers must go to the design side to keep up with the customer.
The cost of building a line is not high, and the equipment is mostly introduced by Taiwanese manufacturers, so the key is the team. The ICP R&D team's job is to have multiple engineers from scratch and go directly to the client to design, so that the import time can be shortened and can be controlled within three weeks. This will save the manufacturer's product certification. Time and cost.
He believes that although two years ago, there was a Taiwan factory that declared that it could use thin film process technology. Although it seems easy, but the resolution, adhesion, reliability meet the requirements, can it pass the test? At present, the market is able to pass these tests, and obviously only a very small number of manufacturers have passed the verification of large manufacturers.
For example, in Q3 2010, the demand for ceramic substrates will come out. At that time, if Taiwanese manufacturers choose the wrong supplier, they may waste more than two months. Therefore, the team factor of the LED heat sink supplier is very important and cannot be dragged down to the progress of the LED package factory.
LED heat sink substrate market trend towards thin film, ceramic substrate
In terms of packaging technology, eutectic packaging, Flip chip packaging, COB packaging, there are many manufacturers in Taiwan to do related technology, trying to meet this market. The current market situation of LED heat-dissipating substrates in Taiwan is based on eutectic, which can be matched with thin-film substrates. The trend of high-power LED products in the future is to make single-line and use one-sided to improve luminous efficiency. In terms of ceramic substrates, thinning will be a trend.
In terms of COB packaging, in the past, using mpcb's technology, when the high power is encountered, such a substrate may cause problems such as the load life of the product due to insufficient heat dissipation of the polymer between the aluminum and the copper metal, and recently responded to the high power COB package. The product quality requirements of the products, mostly using ceramic substrate technology to overcome this problem. There is also a COB package in the Taiwan market, where many small particles are placed on the board, and manufacturers usually try to solve the heat dissipation problem.
Due to the large price difference of COB package, the conversion from thick-die substrate to film substrate is a trend, and the price of using ceramic substrate has been high in the past, but it has also been overcome. The new ceramic heat-dissipating substrate is considered to be integrated design and cost. Has been greatly reduced. The former industry has been educated by the mpcpc industry, the ceramic substrate is very expensive. But now the situation is different, to educate everyone, the price of the two can be very close, the heat dissipation effect is better, and hope to achieve this goal in terms of cost control.
The heat sink substrate of silicon material is still futuristic
At present, both Visera and TSMC are deeply involved in the heat dissipation substrate of silicon materials. Dr. Zhuang believes that the competitiveness of this product lies in competition with aluminum nitride substrates, but it is not comparable to alumina substrates. The advantage is that it can be integrated in a large area, and it can also have the advantage of product design for LED backlight. However, if it is made into a single piece, the competitiveness will be weak, and the development in the next few years is still worth noting. This is because LED epitaxial, package, The assembly is done together and it will have some impact on the market.
Dr. Zhuang pointed out that ICP is focused on the design and manufacture of high-power heat-dissipating substrates, and together with everyone, the LED lighting market will be done. In the future, the mainland China, Europe, and Japan will also gradually promote the market. In addition, ICP also introduces the product of aluminum nitride substrate, which is a product used in the automotive field. It requires more power, one to 10 watts, 20 watts of power, and its process adhesion is more difficult than alumina. The verification time of the depot is also relatively long, but ICP has great confidence in this aspect and has already achieved considerable results.
Future expansion plan
At present, the LED scattered substrate factory has the largest capacity of 250,000 pieces of Tongxin Electric. The current production capacity of ICP is 60,000 pieces. The new factory will continue to be expanded in the future. It is hoped that it will reach 150,000 pieces in Q1 2011. Dr. Zhuang is optimistic about the future demand for 3G and 4G communication mobile phones. It is the world of thin film technology substrates. ICP can improve the visibility in this market by the lower cost and self-designed process of self-built production lines. The smaller the film products are made, the lower the average unit price, and the better the yield, which is where the company excels.
Efforts to develop new LED ceramic heat sink substrate technology, accelerate the production efficiency of LED products, can also be the original film products, give full play to the production line benefits.
Dr. Zhuang believes that the yellow light development equipment plus ceramic substrate technology can provide appropriate products for a variety of industries, whether LED, protective components, passive components, ICP hopes to create a world-class enterprise.
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